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研究生: 高子鈞
Kao, Tzu-Chun
論文名稱: 中美貿易戰下美國雲端伺服器供應商的供應鏈策略
The Supply Chain Strategy of US Cloud Service Providers under U.S.-China Trade War
指導教授: 黃國峯
Huang, Kuo-Feng
口試委員: 林谷合
Lin, Ku-Ho
陳怡安
Chen, Yi-An
酈芃羽
Li, Peng-Yu
學位類別: 碩士
Master
系所名稱: 商學院 - 經營管理碩士學程(EMBA)
Executive Master of Business Administration(EMBA)
論文出版年: 2026
畢業學年度: 114
語文別: 中文
論文頁數: 65
中文關鍵詞: 人工智慧伺服器雲端服務提供者供應鏈中美貿易戰
外文關鍵詞: Artificial Intelligence, Servers, Cloud Service Providers, Supply Chain, U.S.–China Trade War
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  • 近年來,生成式人工智慧(Generative AI)與大型語言模型(Large Language Models, LLMs)的快速發展,使全球對高效能算力的需求呈現爆發性成長。美國主要雲端服務提供者(Cloud Service Providers, CSP),如 Amazon Web Services(AWS)、 Microsoft Azure 與 Google Cloud ,僅成成 AI 算力的核心供應者,同時也成 高階運算硬體需求的最大買方之一。然而AI算力需求暴增的同時,國際政經環境卻日趨僅穩定,尤其中美貿易戰、半導體出口管制與科技戰,使原本高度全球化、分工精細的供應鏈體系面臨前所未有的衝擊。在此情境下,CSP 如何兼顧效能擴張、成本控制與供應安全,成 一項關鍵的管理議題。
    本研究以自研晶片 、 供應鏈策略與營運組織三個面向為分析主軸,探討美國CSP 在AI算力需求急速成長與地緣政治風險升高的雙重壓力下,如何重構其供應鏈管理模式。研究結果顯示,在研發層面,CSP 透過自研晶片(如 AWS 的Trainium、Google 的 TPU、Microsoft 的Maia系列)來降低對單一供應商的依賴,並提升效能與成本優勢;在營運組織層面,CSP建立跨部門供應鏈風險治理架構,整合研發、工程、採購、法遵與政策分析單位,以即時回應地緣政治與法規變化;在策略層面,CSP則透過各階供應商的直接管理 、 供應商管理庫存與培養長期合作的供應商,降低地緣政治衝擊對營運穩定性的威脅。
    本研究認為,供應鏈管理已僅再只是成本與效率導向的營運議題,而是攸關國家安全、科技競爭力與企業長期競爭優勢的核心戰略問題。CSP的供應鏈治理能力,將成 未來AI產業競爭中僅可或缺的關鍵能力之一。


    The rapid advancement of Generative Artificial Intelligence (AI) and Large Language Models (LLMs) has led to an unprecedented surge in global demand for high performance computing resources. Major U.S. Cloud Service Providers (CSPs), including Amazon Web Services (AWS), Microsoft Azure, and Google Cloud, have emerged as both the primary providers of AI computing infrastructure and some of the largest buyers of advanced computing hardware. As AI workloads scale rapidly, these firms play a central role in shaping the structure of the global AI hardware supply chain.
    However, this expansion has occurred amid increasing geopolitical and economic uncertainty. Rising U.S.–China trade tensions, semiconductor export controls, and broader technology competition have disrupted previously highly globalized and specialized supply chain systems, exposing CSPs to new forms of supply risk.
    This study investigates how U.S. CSPs restructure their supply chain management models under the dual pressures of rapidly growing AI computing demand and heightened geopolitical risk. The analysis is organized around three key dimensions: in-house chip development, supply chain strategy, and organizational governance. The findings indicate that CSPs increasingly invest in proprietary chips—such as AWS’s Trainium, Google’s Tensor Processing Units (TPUs), and Microsoft’s Maia series—to reduce reliance on single suppliers, improve performance optimization, and enhance cost control. At the organizational level, CSPs establish cross-functional supply chain risk governance frameworks that integrate research and development, engineering, procurement, compliance, and policy analysis functions to respond more effectively to regulatory and geopolitical changes. Strategically, CSPs strengthen supply resilience through direct multi-tier supplier management, vendor-managed inventory models, and the cultivation of long-term strategic partnerships.
    This study argues that supply chain management has evolved beyond a cost-and efficiency-oriented operational function into a core strategic capability closely linked to national security considerations, technological competitiveness, and long-term advantage in the AI industry.

    目錄
    摘要 1
    Abstract 2
    第一章 緒論 4
    第一節 研究背景 4
    第二節 研究動機 5
    第三節 研究目的 7
    第四節 研究方法與架構 8
    第五節 研究限制與貢獻 10
    第二章 總體環境與產業分析 12
    第一節 近年全球政經局勢 12
    第二節 產業分析 17
    第三節 供應鏈分析 22
    第三章 美國雲端服務提供者的供應鏈策略 28
    第一節 自研晶片的布局 28
    第二節 供應鏈去中化 34
    第三節 CSP的供應鏈策略 42
    第四節 跨部門組織的全球營運 51
    第四章 結論與建議 59
    第一節 結論 59
    第二節 建議 61
    參考文獻 64

    1. Advanced Micro Devices. (2026). AMD Instinct™ MI300 Series Accelerators. AMD.
    2. Amazon Web Services. (2026). AWS Inferentia. Amazon Web Services.
    3. Amazon Web Services. (2026). AWS Trainium. Amazon Web Services.
    4. Amazon. (2026). AWS Trainium and Graviton chips: How Amazon powers AI and cloud computing. About Amazon.
    5. Armbrust, M., Fox, A., Griffith, R., Joseph, A. D., Katz, R. H., Konwinski, A., Lee, G., Patterson, D. A., Rabkin, A., Stoica, I., & Zaharia, M. (2010). A view of cloud computing. Communications of the ACM, 53(4), 50–58.
    6. Chen, S., Chang, S., Lin, A., & Lau, W. (2025). AI Opportunity. Technology Hardware from Aletheia Capital, 1–15.
    7. Christopher, M., & Peck, H. (2004). Building the resilient supply chain. The International Journal of Logistics Management, 15(2), 1–14.
    8. Disney, S. M., & Towill, D. R.(2003)。Vendor-managed inventory and bullwhip reduction in a two-level supply chain。International Journal of Operations & Production Management, 23(6), 625–651.
    9. Dr. Kuo-Feng Huang (2024). Harvard Business Review Taiwan. AI會像網路泡沫嗎?兩者最大的差異在於需求上限.
    10. Gartner. (2023). Cloud infrastructure and platform services market forecast.
    11. Gartner. (2023). Market share analysis: Cloud infrastructure and platform services.
    12. Gartner. AI server market forecast and supply chain trends.
    13. Google Cloud. (2026). Google Axion processors. Google Cloud.
    14. Google Cloud. (2026). Tensor Processing Units. Google Cloud.
    15. McKinsey & Company. (2022). Cloud infrastructure and AI at scale.
    16. McKinsey & Company. (2022). The future of AI infrastructure.
    17. McKinsey & Company. (2023). Geopolitics and the future of global supply chains.
    18. Meta. (2024). Introducing our next generation infrastructure for AI. Meta Newsroom.
    19. Meta. (2026). Expanding Meta’s custom silicon to power our AI workloads. Meta Newsroom.
    20. Microsoft. (2026). Introducing Microsoft’s next-generation AI accelerator: Maia 200. Microsoft News.
    21. NVIDIA. (2026). NVIDIA Blackwell architecture. NVIDIA.
    22. NVIDIA. (2026). NVIDIA GB200 NVL72. NVIDIA.
    23. NVIDIA. (2026). Accelerated computing and Oracle Cloud Infrastructure. NVIDIA.
    24. Oracle. (2026). AI infrastructure. Oracle Cloud Infrastructure.
    25. Oracle. (2026). AI anywhere with Oracle Cloud and NVIDIA. Oracle.
    26. U.S. Congress. (2022). CHIPS and Science Act of 2022, Public Law No. 117–167.
    27. U.S. Congress. (2025). National Defense Authorization Act for Fiscal Year 2026, Public Law No. 119–60.
    28. U.S. Department of Commerce, Bureau of Industry and Security. (2022). Implementation of additional export controls: Certain advanced computing and semiconductor manufacturing items; supercomputer and semiconductor end use; Entity List modification. Federal Register, 87(197), 62186–62215.
    29. U.S. Department of Commerce, Bureau of Industry and Security. (2022). Commerce implements new export controls on advanced computing and semiconductor manufacturing items to the People’s Republic of China.
    30. U.S. Government Accountability Office. (2024). Export controls: Commerce implemented advanced semiconductor rules and took steps to address compliance challenges (GAO-25-107386).
    31. U.S. National Institute of Standards and Technology. (2026). CHIPS for America.
    32. 工業技術研究院(ITRI)產業科技國際策略發展所工業技術研究院《全球AI與半導體產業趨勢分析》。

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