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研究生: 高嘉伶
Kao, Chia-Ling
論文名稱: 美國聯邦及地方政府政策與跨部會機制在吸引臺灣半導體投資中的作用
U.S. Federal and Local Government Policies and Interdepartmental Mechanisms in Attracting Taiwanese Semiconductor Investment
指導教授: 徐愛恩
Tsui, Stephanie
口試委員: 吳⽂傑
Wu, Wen-Chieh
張景宏
Chang, Ching-Hung
學位類別: 碩士
Master
系所名稱: 商學院 - 國際經營管理英語碩士學位學程(IMBA)
International MBA Program College of Commerce(IMBA)
論文出版年: 2025
畢業學年度: 114
語文別: 英文
論文頁數: 136
中文關鍵詞: 半導體美台關係投資政策亞利桑那州
外文關鍵詞: Semiconductor, U.S.-Taiwan relationship, Investment, Policy, State of Arizona
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  • 本論文探討美國聯邦及州政府為吸引台灣半導體公司的海外直接投資(FDI)所採行的策略與操作架構。當半導體製造已成為全球經濟安全的關鍵,本研究分析美國如何在此背景下重新塑造與身為先進晶片製造全球霸主的台灣之雙邊合作關係。研究採用質性個案研究方法,結合政策文件分析與對聯邦官員及亞利桑那州的駐台貿易代表之半結構式訪談,以檢視產業政策在實際執行與落地情形。

    此研究介紹《晶片與科學法案》(CHIPS and Science Act)為美國供應鏈回流的主要聯邦支柱,透過補助與稅務抵減機制,協助分散龐大資本投資所面臨的風險。然而,成功同樣仰賴跨部會協調機制的運作,其中美國商務部與美國在台協會(AIT)扮演關鍵橋樑角色,用以弭平政策溝通上的落差。在州層級方面,亞利桑那州能吸引逾數十億美元投資,主要歸功於在地化的投資誘因以及與大學建立的合作關係,從而形成具韌性的供應鏈樞紐。

    研究亦發現企業面臨多項結構性挑戰,包括顯著的成本差距、跨文化管理摩擦以及繁複的行政程序。此外,聯邦政府的政權更迭與協議重談,也為政策環境帶來新的不確定性。整體而言,這些協調行動為更具韌性且高度整合的美台半導體生態系奠定了基礎。


    This thesis investigates the strategic and operational frameworks employed by U.S. federal and state governments to attract foreign direct investment (FDI) from Taiwanese semiconductor firms. In an era where semiconductor manufacturing is essential to global economic security, this research explores how the United States is reshaping its bilateral partnership with Taiwan, the world’s dominant player in advanced chip fabrication. Employing a qualitative case study methodology, the study combines policy document reviews with semi-structured interviews of federal officials and Arizona-based trade representative to analyze the actual implementation of high-level industrial policies.
    The findings introduces the CHIPS and Science Act as the primary federal pillar for reshoring, providing the grants and tax credits necessary to de-risk massive capital investments. However, success relied equally on coordinated interdepartmental mechanisms, with the U.S. Department of Commerce and American Institute in Taiwan (AIT) acting as critical conduits to bridge communication gaps. At the state level, Arizona’s success in attracting over billions of investments is attributed to localized incentives and university partnerships that created a robust supply chain hub.
    The research also covers that firms face significant structural challenges, including a substantial cost gap, cultural management friction, and bureaucratic complexity. Furthermore, political transitions and the renegotiation of agreements between federal administrations have introduced new policy uncertainties. Ultimately, all these coordinated efforts have laid the foundation for a more resilient and integrated U.S.-Taiwan semiconductor ecosystem.

    1.  Introduction  1
    1.1.  Problem Background  2
    1.2.  Research Rationale  2
    1.3.  Research Objectives  3
    1.4.  Research Methodology  4
    1.5.  Research Limitation and Future Research  4
    2.  Industry Landscape  6
    2.1.  The U.S.–Taiwan Economic Relationship  6
    2.2.  Current U.S. Semiconductor Industry Landscape  8
    2.3.  Taiwan’s Role in Global Semiconductor Supply Chain  10
    2.4.  The U.S.–Taiwan Semiconductor Relationship  12
    3.  Behind Investing into the United States  15
    3.1.  Drivers of Investing into the United States  15
    3.2.  Public’s Concern to Semiconductor Companies’ Expansion into the United States  20
    4.  Role of Federal Government  22
    4.1.  Department of Commerce  22
    4.2.  Other Agencies  29
    5.  Role of Local Government  31
    5.1.  Current U.S. State Offices in Taiwan  31
    5.2.  Arizona‑Taiwan Trade & Investment Office  33
    6.  Government Incentive Programs and Policy  36
    6.1.  Federal Government Funding Program - CHIPS for America  36
    6.2.  Federal Policy Shifts Between Administrations  51
    6.3.  State-level Incentives  54
    7.  Investment Facilitation in Practice  64
    7.1.  Federal government level  64
    7.2.  Arizona Trade & Investment Office in Taiwan  77
    8.  Challenges to the Investors’  82
    9.  Outcomes and Impacts  88
    10.  Conclusion  92
    11.  Reference  95
    12.  Appendix  103
    12.1.  Interview Record: Clint Brewer, U.S. Department of Commerce  103
    12.2.  Interview Record: Sandy Lee, Arizona Commerce Authority  115
    12.3.  Interview Record: Jason Chang, U.S. Department of Commerce  124

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