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| 研究生： |
劉達智 Liou, Edwin |
|---|---|
| 論文名稱： |
晶圓代工業協同電子商務對交易成本影響之個案研究 A case study of collaborative commerce in the semiconductor foundry industry, from the transaction cost perspective |
| 指導教授： | 溫肇東 |
| 學位類別： |
碩士
Master |
| 系所名稱： |
商學院 - 經營管理碩士學程(EMBA) Executive Master of Business Administration(EMBA) |
| 論文出版年： | 2009 |
| 畢業學年度： | 97 |
| 語文別： | 英文 |
| 論文頁數： | 87 |
| 中文關鍵詞： | 交易成本 、半導體 、晶圓代工 、協同電子商務 、垂直整合 |
| 外文關鍵詞： | Dis-integration |
| 相關次數： | 點閱：114 下載：106 |
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半導體產業自 1950/1960 年代創始以來, 即以高度垂直整合的型式存在. 電路設計, 製程技術開發, 晶圓製造, CP測試, 封裝, 以及 FT測試 都是在同一公司完成. 至今日為止, 雖然仍然有不少的高度垂直整合的半導體公司存在, 許多的半導體公司已開始轉向為較低度垂直整合的型式存在. 在現代的產業術語中, 這些不同的產業單位被稱為整合元件廠 (IDM), 輕晶圓廠公司 (Fab-lite), 無晶圓廠公司(fab-less), 晶圓代工(wafer foundry), 外包封裝測試公司 (OSAT), 等等.
半導體產業自高度整合的IDM模式走向設計與製造分離的商業模式是一個許多人有興趣探討的課題. 其中一項很明顯的因素就是半導體製程開發及產能建置所需的龐大資金所造就出的專業晶圓代工模式. 但是,當專業晶圓代工模式帶入大量的經濟效益的同時, 眾多的公司在半導體產業中跨公司的交易成本亦大量增加. 在本論文中, 作者試圖以個案分析的方法, 探討半導體產業中一家專業晶圓代工公司 (A 公司) 如何使用協同電子商務來降低與客戶之間的交易成本.
Coase and Williamson為主所發展出的交易成本經濟學 (Transaction Cost Economics, TCE)為本論文提供了一個良好的理論架構. 這些專精不同的半導體公司(Firms)在半導體產業中(Market)交易(Transact). 當面對不同程度的交易障礙時, 都會努力使這些障礙降低.
本論文之目標是以 Coase/William的TCE為架構, 定性分析出晶圓代工產業的協同電子商務在降低交易成本的效益. 在針對Ａ公司的個案研究中，研究結果指出, 協同電子商務在降低監督成本上是相當顯著的. 其次為搜尋成本及訂約成本的降低. 效益較不顯著的則為違約成本的降低.
The Semiconductor Industry started out in the 1950/1960 time frame, in the form of highly vertical integration. Circuit design, process technology development, wafer manufacturing, circuit probe operations, assembly manufacturing and final testing operations were all performed within a company. Although vertically integrated semiconductor companies still have strong presence in today’s industry, many others have turned much less vertically integrated. In semiconductor industry’s jargons, these various entities are: IDMs (Integrated Device Manufacturers), Fab-lite, Fabless, wafer foundries, OSATs (Out Sourced Assembly and Test), etc…
This phenomenon of the semiconductor industry going from being highly integrated towards being highly disintegrated is of interest to many. One of the obvious driving forces is the emergence of the wafer foundry segment in the industry due to the heavy investment in the process technology development and the manufacturing capacity build-up. Given the need for the tight collaboration among various semiconductor industry functions, this disintegration undoubtedly imposed much inter-company collaboration barrier along the value chain. In this paper, the study focuses on how a company (“Company A”) in the wafer foundry segment uses collaborative commerce to provide an integration platform for its trading partners to reduce the barrier of conducting business with each other.
Transaction Cost Economy (TCE), a term coined by Coase and Williamson, provided an excellent research framework for this case. The barrier existing in these interdependent semiconductor companies along the value change can be viewed as “firms” in the “market”, while facing the significant barrier (transaction costs), looking for ways to maximize the profits for individual firms, and hopefully for the whole value chain as well.
In short, this paper analyzes the qualitative effect of the collaborative commerce in a semiconductor foundry company in reducing the inter-company transaction cost within the Coase and Williamson TCE framework. Based on the case study of company A, the results indicate that Collaborative Commerce has significant impact on monitoring cost reduction. It also helps reduce the cost of searching and contracting. On the enforcement cost reduction, Collaborative Commerce plays a relatively weaker role.
Key Words: Transaction Cost, Collaborative Commerce, Semiconductor, Foundry, Integration, Dis-integration
Acknowledgment................................................................................................................... . ..2
Abstract.....................................................................................................................................3
Chinese Abstract........................................................................................................................4
Table of Contents...................................................................................................................... .5
List of Figures........................................................................................................................... 7
List of Tables............................................................................................................................ 8
Chapter 1, Introduction..............................................................................................................9
Section 1.1, Background................................................................................................9
Section 1.2, Objectives of the Research.......................................................................11
Section 1.3, Scope and Limitations of the Research....................................................11
Chapter 2, Literature Review.................................................................................................. .13
Section 2.1, Theories related to Transaction Costs..................................................... .13
Section 2.2, The Semiconductor Industry’s Evolution:
From IDM to beyond IDM......................................................................23
Section 2.3, Semiconductor Foundries: How they Work,
Evolution and Outlook.............................................................................26
Section 2.4, Collaborative Commerce..........................................................................32
Section 2.5, Assertions of Prior Scholars:
Transaction Cost Economics within a
Collaborative Commerce Framework......................................................35
Chapter 3, Research Methodology...........................................................................................37
Section 3.1, Selection of the Method, Case Study.......................................................37
Section 3.2, Selection of the Case,
Information Collection and Analysis.......................................................39
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Section 3.3, Research Framework................................................................................40
Chapter 4, Case Study..............................................................................................................44
Section 4.1, The Company...........................................................................................44
Section 4.2, The Services Offered by the Company.....................................................45
Section 4.3, Collaborative Commerce Solutions at Company A.................................49
Section 4.3.1, Platform View................................................................................49
Section 4.3.2, Functional View............................................................................63
Section 4.4, Customer Survey......................................................................................66
Chapter 5, Matrix Analysis.......................................................................................................70
Section 5.1, Searching Cost Reduction........................................................................70
Section 5.2, Contracting Cost Reduction.....................................................................72
Section 5.3, Monitoring Cost Reduction......................................................................74
Section 5.4, Enforcement Cost Reduction................................................................. . .79
Section 5.5, Summary...................................................................................................80
Chapter 6, Summary and Recommendations...........................................................................83
Section 6.1, Summary...................................................................................................83
Section 6.2, Recommendations....................................................................................84
Works Cited.............................................................................................................................86
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List of Figures
Figure 1.1 Vertical Disintegration of the Semiconductor Industry....................................12
Figure 2.1 Illustration of Transaction Costs within the Market.........................................14
Figure 2.2 The Triangle of Asset Specificity.....................................................................20
Figure 2.3 Types of Transaction Costs...............................................................................23
Figure 2.4 Pure-Play vs. IDM Foundry Marketshare ($)..................................................30
Figure 2.5 Foundry Sales as a Percent of Total IC Sales..................................................30
Figure 2.6 Fabless and IDM Company IC Sales ($B)..............................................….....31
Figure 3.1 The Decision-Making Process of a Case Study Report...................................38
Figure 3.2 Interactions between Collaboration and Transaction Costs.............................41
Figure 4.1 IC Development Cycle Stage...........................................................................45
Figure 4.2 A-Direct System Architecture..........................................................................55
Figure 4.3 B2Bi Scenario.................................................................................................. 58
Figure 4.4 A-Yes................................................................................................................59
Figure 4.5 Typical A-Yes Features.....................................................................................60
Figure 4.6 A-Internet Layout Viewer.................................................................................61
Figure 4.7 A-eJobView............................................................................................ . .........62
Figure 4.8 Design/Engineering/Logistics Collaboration...................................................63
Figure 4.9 Survey Results..................................................................................................69
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